TimmyHPiping Hot - IBM proves computers and water DO mix
June 8th 2008 04:35
Although it might at first seem like a terrible idea to pump water through your PC, researchers at IBM believe that this could be a breakthrough in next-generation computer technology.
With computer chips getting ever-smaller, stacking more and more processing power into infintessimally small spaces, the physics of heat is becomming a greater problem in modern computing. Although heat absorbing materials like "heat sinks" are currently being employed to tackle the problem, these can only do so much in tiny places.
IBM is currently exploring a microprocessor design whose heat-to-volume ratio exceeds that of a nuclear reactor, stacking chips vertically rather than aligning them side by side. To address the heat problem which this will create, researchers are suggesting that they might be able to pipe water through 50 micron tubes between these sandwiched chips.The tiny tubs are obviously sealed to prevent leaks and internal damage.
Some high-end computers have used water cooling for some time, because it is much more efficient than air. But IBM's system would be the first to employ the technique within chips themselves.
Richard Doherty of the Envisioneering Group says "It's (chip water cooling) never been applied this close to the heart of the matter"
Aspects of IBM's approach have already been demonstrated by other research teams, but this would be the first commercialisation of the technique. But consumers shouldn't hold their breathe for fear of being drowned in 50 microns of water just yet. The technology is still in production and might be as many as 5 years away.
With computer chips getting ever-smaller, stacking more and more processing power into infintessimally small spaces, the physics of heat is becomming a greater problem in modern computing. Although heat absorbing materials like "heat sinks" are currently being employed to tackle the problem, these can only do so much in tiny places.
IBM is currently exploring a microprocessor design whose heat-to-volume ratio exceeds that of a nuclear reactor, stacking chips vertically rather than aligning them side by side. To address the heat problem which this will create, researchers are suggesting that they might be able to pipe water through 50 micron tubes between these sandwiched chips.The tiny tubs are obviously sealed to prevent leaks and internal damage.
Some high-end computers have used water cooling for some time, because it is much more efficient than air. But IBM's system would be the first to employ the technique within chips themselves.
Richard Doherty of the Envisioneering Group says "It's (chip water cooling) never been applied this close to the heart of the matter"
Aspects of IBM's approach have already been demonstrated by other research teams, but this would be the first commercialisation of the technique. But consumers shouldn't hold their breathe for fear of being drowned in 50 microns of water just yet. The technology is still in production and might be as many as 5 years away.
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